Features Direct ToF technology with high sensitivity SPAD detection 8×8 configurable multi-zone configuration with multi-object detection Adjustable field of view (up to 63° diagonal) Fast Time-to-Digital Converter (TDC) architecture Sub-nanosecond light pulse 10 – 5000mm distance sensing @ 30Hz On-chip histogram processing 940nm VCSEL Class 1 Eye Safety High performance on-chip sunlight rejection filter and […]
Merkmale Direkte ToF-Technologie mit hochempfindlicher SPAD-Erkennung 8×8 konfigurierbare Multizonen-Konfiguration mit Multi-Objekt-Erkennung Einstellbares Sichtfeld (bis zu 63° diagonal) Schnelle Time-to-Digital Converter (TDC) Architektur Sub-Nanosekunden-Lichtimpuls Entfernungsmessung von 10 bis 5000 mm bei 30 Hz On-Chip-Histogramm-Verarbeitung 940nm VCSEL Klasse 1 Augensicherheit Leistungsstarker On-Chip-Filter und Algorithmus zur Unterdrückung von Sonnenlicht Kleines modulares OLGA-Gehäuse (2,0 mm x 4,6 mm x
CaracterÃsticas TecnologÃa ToF directa con detección SPAD de alta sensibilidad Configuración multizonal configurable 8×8 con detección multiobjeto Campo de visión ajustable (hasta 63° de diagonal) Arquitectura de convertidor rápido de tiempo a digital (TDC) Pulso de luz de sub-nanosegundo Detección de distancias de 10 a 5000 mm a 30 Hz Procesamiento del histograma en el
Caratteristiche Tecnologia ToF diretta con rilevamento SPAD altamente sensibile Configurazione multizona configurabile 8×8 con rilevamento di più oggetti Campo visivo regolabile (fino a 63° di diagonale) Architettura veloce del convertitore tempo-digitale (TDC) Impulso di luce sub-nanosecondo Misura della distanza da 10 a 5000 mm a 30 Hz Elaborazione dell’istogramma su chip 940nm VCSEL Classe 1
CaracterÃsticas TecnologÃa ToF directa con detección SPAD de alta sensibilidad Configuración multizona configurable 4×4 con detección multiobjeto Campo de visión ajustable (hasta 63° de diagonal) Arquitectura de convertidor rápido de tiempo a digital (TDC) Pulso de luz de sub-nanosegundo Detección de distancias de 10 a 5000 mm a 30 Hz Procesamiento del histograma en el
Merkmale Direkte ToF-Technologie mit hochempfindlicher SPAD-Erkennung 4×4 konfigurierbare Multizonen-Konfiguration mit Multi-Objekt-Erkennung Einstellbares Sichtfeld (bis zu 63° diagonal) Schnelle Time-to-Digital Converter (TDC) Architektur Sub-Nanosekunden-Lichtimpuls Entfernungsmessung von 10 bis 5000 mm bei 30 Hz On-Chip-Histogramm-Verarbeitung 940nm VCSEL Klasse 1 Augensicherheit Leistungsstarker On-Chip-Filter und Algorithmus zur Unterdrückung von Sonnenlicht Kleines modulares OLGA-Gehäuse (2,0 mm x 4,6 mm x
Features Direct ToF technology with high sensitivity SPAD detection 4×4 configurable multi-zone configuration with multi-object detection Adjustable field of view (up to 63° diagonal) Fast Time-to-Digital Converter (TDC) architecture Sub-nanosecond light pulse 10 – 5000mm distance sensing @ 30Hz On-chip histogram processing 940nm VCSEL Class 1 Eye Safety High performance on-chip sunlight rejection filter and
Caratteristiche Tecnologia ToF diretta con rilevamento SPAD altamente sensibile Configurazione multizona configurabile 4×4 con rilevamento di più oggetti Campo visivo regolabile (fino a 63° di diagonale) Architettura veloce del convertitore tempo-digitale (TDC) Impulso di luce sub-nanosecondo Misura della distanza da 10 a 5000 mm a 30 Hz Elaborazione dell’istogramma su chip 940nm VCSEL Classe 1
Caratteristiche Tecnologia ToF diretta con rilevamento SPAD altamente sensibile Configurazione multizona 3×3 con rilevamento di più oggetti Campo visivo regolabile (fino a 63° di diagonale) Architettura veloce del convertitore tempo-digitale (TDC) Impulso di luce sub-nanosecondo Misura della distanza da 10 a 5000 mm a 30 Hz Elaborazione dell’istogramma su chip 940nm VCSEL Classe 1 Sicurezza
CaracterÃsticas TecnologÃa ToF directa con detección SPAD de alta sensibilidad Configuración multizona 3×3 con detección multiobjeto Campo de visión ajustable (hasta 63° de diagonal) Arquitectura de convertidor rápido de tiempo a digital (TDC) Pulso de luz de sub-nanosegundo Detección de distancias de 10 a 5000 mm a 30 Hz Procesamiento de histogramas en el chip
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