Features
- Small footprint and low profile package (3.10 x 2.05 x 1.00 mm)
- 0.18μm process technology with 1.8V I²C bus
Benefits
- Reduced board space requirements and enables low profile system design
- Reduced power consumption
Supply Voltage | 1.7-2.0 |
---|---|
I²C Bus | 1.8V |
Programmable | Gain, integration time, interrupt |
Integrated Capabilities and Components | IR LED |
Recommended Operating Distances | <15 |
Temperature Range | -30 to 85 |
Package | Surface-mount module, pin count 8 |