The progressive integration of technology into all aspects of our lives requires proper thermal management of integrated electronic components for the benefit of higher system performance and efficiency.
Today, the industry places more emphasis on electronic solutions than on mechanical designs. Aismalibar’s products reduce the operating temperature of electronic components, which prolongs their life and also optimizes their performance.
The use of Aismalibar products guarantees the quality and reliability of our customers’ products. The installation of fans is usually no longer necessary. This saves energy, effort and costs in terms of a more sustainable and environmentally friendly technology.
Interface materials
The isolated metal substrates of AISMALIBAR allow processing with standard PCB methods and integrate heat dissipation without additional components and SMD assembly process. Thick aluminum-based substrate laminated with ED copper foil. Designed for effective heat dissipation and high electrical insulation. Our specially formulated polymer ceramic ensures high thermal conductivity, dielectric strength and thermal resistance.
IMS - METAL CLAD
Thick aluminum-based substrate laminated with ED copper foil. Designed for effective heat dissipation and high electrical insulation. Our specially formulated polymer ceramic ensures high thermal conductivity, dielectric strength and thermal resistance. AISMALIBAR’s insulated metal substrates enable processing with standard PCB methods and integrate heat dissipation without additional components and SMD assembly process.
Multilayer
Multilayer PCBs are often requested for complex PCBs with denser circuitry. This combination of multiple layers allows for better functions and connections. AISMALIBAR offers various substrates that can be combined to provide unique solutions tailored to your electronic designs.
BOND SHEET
AISMALIBAR offers a range of high performance thermal conductive films (thermal prepegs) for various applications in PCBs and MPCBs. By using heat conducting foils, the dielectric layers become thermally conductive and are ideally suited for conducting heat from the heat-generating components located on the functional copper to the copper layer or heat sink layer on the opposite side. Thermally conductive films are available in thicknesses between 80 and 100 µm (3.1 and 4 milli = thousandths of an inch), with thermal conductivity of 2.2 W/mK or 3.2 W/mK. Thermally conductive foils are used in standard multilayer lamination processes. Their high thermal shock resistance, coupled with their high thermal conductivity, guarantees reliable and efficient heat dissipation in heat-critical circuits.
Copper laminated laminate
Copper-clad laminates consist of an inner layer of prepreg laminated on both sides with a thin layer of copper foil. Lamination is achieved by pressing one or more layers of copper and prepreg together under high heat, pressure and vacuum conditions.
