Features Direct ToF technology with high sensitivity SPAD detection Fast Time-to-Digital Converter (TDC) architecture Sub-nanosecond light pulse 0 – 10cm proximity detection and 10 – 60cm distance sensing @ 60Hz On-chip histogram processing 940nm VCSEL Class 1 Eye Safety with 21° FOI Sunlight on-chip rejection filter and algorithm Industry’s smallest modular OLGA 2.2mm x 3.6mm […]
Features Integrated proximity detection sensor and IR LED Patented dual-diode architecture Proximity detection calibrated and trimmed to provide consistent reading Programmable LED drive current Benefits Module reduces board space and design effort Enables operation in IR light environments Pre-calibration eliminates need for customer to calibrate the end product Allows multiple power level selection without external
Features Integrated proximity detection sensor and IR LED Patented dual-diode architecture Proximity detection calibrated and trimmed to provide consistent reading Programmable LED drive current Benefits Module reduces board space and design effort Enables operation in IR light environments Pre-calibration eliminates need for customer to calibrate the end product Allows multiple power level selection without external
Features Low-profile (0.35mm) and ultra-small (0.7mm³) volumetric size Proximity crosstalk compensation 940nm IR proximity with automatic ambient light subtraction Automatic single alternative I²C address option Split near/far photodiodes and offset emitter/detector placement 0.18µm process technology with 1.8V I²C Small footprint 2.0 mm x 1.0 mm x 0.35 mm package Benefits Ideal for the smallest size
Features Ultra-Small (1.0mm3) volumetric size Proximity crosstalk compensation 940nm IR proximity with automatic ambient light subtraction Automatic single alternative I²C address option Split near/far photodiodes and offset emitter/detector placement 0.18µm process technology with 1.8V I²C Small footprint and low profile 2.0mm x 1.0mm x 0.5 mm package Benefits Ideal for the smallest size applications Enables
Features Small footprint and low profile package (3.10 x 2.05 x 1.00 mm) 0.18μm process technology with 1.8V I²C bus Benefits Reduced board space requirements and enables low profile system design Reduced power consumption
Features 102 sensor element organization 300 DPI sensor pitch Digital output Programmable gain Benefits Provides high density pixel count Enables high resolution scanning Provides integrated analog-to-digital conversion Enables scalable operating range
Features 128 sensor element organization 400 DPI sensor pitch High linearity and uniformity Rail-to-rail output swing Benefits Provides high density pixel count Enables high resolution scanning Enables capacitive threshold sensing Provides full dynamic range
Features 128 x 1 sensor element organization 400 DPI sensor pitch High linearity and uniformity Rail-to-rail output swing Benefits Enables high resolution edge detection Supports high resolution OCR, barcode reading Facilitates grey scale scanning and accurate positioning Utilizes full ADC input range
Features 850K:1 input dynamic range Low dark frequency (0.6Hz typical) 2.6mm x 3.8mm 4-lead SMD (T) package Benefits Detects light intensity at a high resolution Provides low light level operation Reduces board space requirements while simplifying designs
